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📖 Technical Terms Explained

Performance & Specifications

Performance Index
A normalized benchmark score combining single-threaded performance, multi-threaded workloads, and power efficiency. Calculated from real-world testing across gaming, productivity, and rendering tasks. Higher numbers indicate better overall performance. Used to compare CPUs across different generations and architectures, providing a single metric to understand relative capabilities.
TDP (Thermal Design Power)
The amount of heat a CPU is designed to dissipate under typical load conditions, measured in watts. Higher TDP generally indicates higher performance potential but requires better cooling solutions. For example, a 125W CPU will perform better than a 65W variant but needs a more robust cooler. T-series CPUs (35W) prioritize efficiency over performance for compact builds.
Base Clock / Boost Clock
Base clock is the minimum guaranteed speed the CPU runs at, while boost clock is the maximum speed under load when thermal and power conditions allow. Modern CPUs spend most time at boost speeds during demanding tasks. For example, a CPU with 3.6 GHz base and 5.0 GHz boost will typically run at 5.0 GHz during gaming when properly cooled.
Cores & Threads
Cores are independent processing units within the CPU. Threads represent simultaneous instruction streams each core can handle. CPUs with SMT (Simultaneous Multithreading) or Hyperthreading allow each core to handle 2 threads, effectively doubling multitasking capability. For example, an 8-core/16-thread CPU has 8 physical cores handling 16 simultaneous tasks.
P-cores / E-cores (Performance / Efficiency Cores)
Intel's hybrid architecture design combining Performance cores (fast, high-power) with Efficiency cores (slower, low-power). P-cores handle demanding tasks like gaming, while E-cores manage background processes and improve battery life. For example, Core i9-14900K has 8 P-cores for gaming and 16 E-cores for multitasking, optimizing both speed and efficiency.

Memory & Cache

L3 Cache
Level 3 cache is fast memory located close to CPU cores, storing frequently accessed data to reduce slow trips to system RAM. More L3 cache improves performance, especially in gaming where repeated data access is common. Measured in megabytes (MB), typical gaming CPUs have 32-96MB, while workstation chips may exceed 256MB for complex workflows.
3D V-Cache
AMD's innovative stacked cache technology that vertically adds extra L3 cache directly on top of CPU cores. This dramatically reduces memory latency and improves gaming performance by 10-30% in cache-sensitive titles. Found in X3D-branded CPUs like Ryzen 7 9800X3D, it provides 96-128MB total L3 cache compared to 32-64MB on standard models.
Memory Support (DDR4 / DDR5)
The type and speed of system RAM the CPU supports. DDR5 is newer and faster than DDR4, offering higher bandwidth and lower latency for improved performance. Most modern CPUs (2022+) support DDR5, while older platforms use DDR4. Some CPUs support both for platform flexibility. Memory speed measured in MT/s (megatransfers per second), like DDR5-5600 or DDR4-3200.

Technologies

SMT / Hyperthreading
Simultaneous Multithreading (AMD) or Hyperthreading (Intel) allows each physical CPU core to handle two instruction threads simultaneously. This improves multitasking and productivity performance by up to 30% in applications that can utilize multiple threads. Most modern CPUs include this feature, showing as double the thread count versus core count (e.g., 8 cores / 16 threads).
PCIe Lanes / Generation
PCI Express lanes are data highways connecting the CPU to GPUs, storage, and peripherals. More lanes allow more high-speed devices simultaneously. PCIe generations (3.0, 4.0, 5.0) indicate bandwidth per lane - each generation doubles speed. For example, PCIe 5.0 provides 32 GB/s per x16 slot compared to 16 GB/s for PCIe 4.0, benefiting high-end GPUs and NVMe SSDs.
Integrated Graphics (iGPU)
Graphics processing built directly into the CPU, eliminating need for discrete GPU in basic systems. Sufficient for office work, video playback, and light gaming. Intel UHD/Iris graphics and AMD Radeon Graphics (in G-series) provide display output and basic 3D acceleration. F-series Intel CPUs and non-G AMD CPUs lack integrated graphics, requiring dedicated GPU.

CPU Variants

K / KF / X / XT Suffixes
Intel K-series CPUs have unlocked multipliers for overclocking. KF variants lack integrated graphics, reducing cost for users with discrete GPUs. AMD X-series represents high-performance variants with higher boost clocks and TDP. XT models are refined versions with improved binning and slightly higher specifications within the same generation.
T-series (Low Power)
Intel CPUs with 35W TDP designed for compact, quiet, and energy-efficient systems. They offer 65-80% of K-series performance while consuming significantly less power and generating less heat. Perfect for small form factor builds, HTPCs, and office workstations where thermal constraints or power efficiency matter more than maximum performance.
F-series (No iGPU)
Intel CPUs without integrated graphics, sold at lower prices than equivalent models with iGPU. Identical CPU performance but requires discrete graphics card for display output. For example, Core i5-14600KF offers same gaming performance as i5-14600K at $20-30 less, making it ideal for gaming builds that already include dedicated GPU.
PRO / vPRO
Business-focused CPUs with enhanced security features, improved stability validation, extended warranty support, and enterprise management capabilities. AMD PRO and Intel vPRO include hardware-based security, remote management, and guaranteed availability for commercial deployments. Common in corporate workstations, they provide IT departments with enhanced control and reliability.

Architecture

Zen Architecture (AMD)
AMD's modern CPU architecture family. Zen 3 brought significant IPC improvements, Zen 4 introduced DDR5 and PCIe 5.0, and Zen 5 offers further efficiency gains. Each generation provides 10-20% performance improvements through architectural refinements while maintaining backward compatibility within AM4 or AM5 platforms. Higher Zen numbers indicate newer, more advanced designs.
Alder Lake / Raptor Lake / Arrow Lake (Intel)
Intel's recent architecture generations. Alder Lake (12th gen) introduced hybrid P-core/E-core design. Raptor Lake (13th/14th gen) refined this with more E-cores. Arrow Lake (Core Ultra) represents latest architecture with enhanced AI capabilities and improved power efficiency through disaggregated tile-based design.
Socket Type
The physical interface connecting CPU to motherboard. Common sockets include AM5 (AMD Ryzen 7000+), AM4 (AMD Ryzen 1000-5000), LGA1700 (Intel 12th-14th gen), and LGA1851 (Intel Core Ultra). CPU and motherboard sockets must match exactly. AMD typically maintains socket compatibility longer (AM4 lasted 5+ years), while Intel changes sockets more frequently.
Chiplet Design
Modern architecture approach splitting CPU into smaller dies (chiplets) rather than single monolithic chip. AMD uses chiplets for CPU cores, I/O, and cache, improving manufacturing yields and enabling easier scaling. Benefits include lower production costs, better thermal characteristics, and flexibility in core counts. Most high-end AMD processors use chiplet designs.