AMD
Ryzen 7 8845HS
Ryzen 7
Overall Rank
(Consumer CPUs only)
(Consumer CPUs only)
#90
of 234
Overall Rank
#107
of 251
Value Rank
#208
of 207
Gaming Rank
#105
of 251
Productivity Rank
#116
of 251
Core Specifications
Cores
8
Threads
16
Base Clock
3.8 GHz
Boost Clock (Single)
5.1 GHz
Socket
FP7/FP7r2
Lithography
4nm
Cache
L1 Cache
N/A
L2 Cache
N/A
L3 Cache
16 MB (shared)
Power & Thermal
TDP
35W
Base Power
35W
Max Turbo Power
54W
Memory Support
Memory Types
DDR5-5600, LPDDR5x-7500
Max Memory
256GB
Memory Channels
2
ECC Support
No
Platform & Connectivity
PCIe Version
4.0
PCIe Lanes
N/A
Integrated GPU
Yes
Integrated GPU Model
Radeon 780M
Closest Competitors by Performance
Ryzen 7 7745HX13,439
Core Ultra 7 255H13,314
Ryzen 7 8845HS (Selected)11,903
Ryzen AI 7 35011,564
Ryzen 5 7645HX10,977
Quick Stats
Generation
Hawk Point (Zen 4)
Release Date
12/1/2023 - 2 years old
Status
Available
Market Segment
Laptop
Performance Scores
Overall
11903Measured against consumer CPUs only
Efficiency340.1
Benchmark Scores
Cinebench R23 Single1,775
Cinebench R23 Multi16,232
Geekbench 6 Single2,332
Geekbench 6 Multi11,039
PassMark28,460
Console Comparison
Comparison based on overall performance score calculated from multi-core benchmarks. Console CPUs are optimized for gaming workloads.
Ryzen 7 8845HS
100%100%
Xbox Series X(Gen 9 (2020))
83%83%
PS5(Gen 9 (2020))
79%79%
Xbox One X(Gen 8 Mid (2016-2017))
15%PS4 Pro(Gen 8 Mid (2016-2017))
14%Notes
The Ryzen 7 8845HS features 8 cores and 16 threads on Zen 4 architecture with 35W TDP for premium thin-and-light gaming and creator laptops. This processor delivers excellent performance in compact chassis, balancing power and efficiency. Built with modern Zen 4 architecture providing strong single-threaded and multi-threaded capabilities. The integrated Radeon 780M graphics offer capable gaming and creative performance. Perfect for premium ultraportable gaming laptops, creator systems, and high-end ultrabooks requiring strong performance without bulk. The HS designation indicates optimized efficiency for thermally-constrained designs, delivering impressive performance in compact, portable form factors.